Tom joined Nuvotronics in January 2014 after spending 20 years with Harris Corporation in Melbourne, Florida. While at Harris, Tom held technical and managerial leadership roles which included heading Harris’ Internal Research & Development efforts for high density phased array packaging technologies, and prior to that, serving as the Senior Engineering Manager for company’s Advanced Operations Technology (AOT) organization. Tom earned BSEE and MSEE degrees from the Georgia Institute of Technology in 1991 and 1993 respectively.
Brian Sousa joined Nuvotronics in January of 2017 and oversees the production and development assembly areas. Brian has been working in the Microelectronics field for over 30 years and has a strong manufacturing and operations background across a diverse range of electronic technologies. During his tenure Brian has been instrumental in the development and implementation of manual and automated assembly lines along with supporting shop floor control and MRP systems. Immediately prior to transitioning to Nuvotronics, Brian headed QORVO/RFMD’s AS9100 certified Aerospace and Defense Operations group in Broomfield, CO where his team was responsible for manufacturing high powered Gallium Nitride assemblies along with supporting an extensive business in Space and High Reliability microelectronic designs. In 1984, Brian earned a BSMT from the University of Connecticut.
Boyd Rogers has over 25 years of experience in wafer fabrication, advanced packaging and process development. Before coming to Nuvotronics, Boyd served stints as VP of R&D for Deca Technologies and as VP for Bumping and WLCSP Development at Amkor Technology. He became a member of Amkor through the acquisition of Unitive Electronics in 2004. At Unitive, Boyd worked with other senior staff in pioneering Unitive’s WLCSP and SnAg bump electroplating technologies. In the 1990’s, Boyd held positions at the Dow Chemical Company, developing processing guidelines for Photo-BCB, and at the MCNC Center for Microelectronics, where he worked on multilevel metallization for backend chip fabrication. Boyd holds a Doctorate in Electrical Engineering from Duke University and a BS in Physics from Wake Forest University. He has been awarded several industry patents and has published more than 20 technical papers.