Our millimeter wave packages and transmission lines are high-performance, surface-mount solutions that overcome the limitations of traditional RF system design on low-cost printed circuit boards. Leveraging our proprietary PolyStrata® technology, these compact, low-loss components deliver exceptional signal integrity and integration ease, enabling scalable, cost-effective deployment in high-frequency applications
Our millimeter wave packages are engineered for optimal performance in high-frequency environments, offering air-cavity, wire-bonded MMIC integration in a surface-mountable form factor. These packages maintain signal fidelity through precise impedance control and minimal parasitic effects, while interfacing efficiently with standard PCB materials. The package body is constructed from high-thermal conductivity copper, enabling efficient heat spreading to support reliable operation in thermally demanding applications.
Standard mmWave Packages
| Single Sided Transition Performance | Max Die Size | Package Size | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number | Lid # | Max Frequency (GHz) | Insertion Loss (AB) | Return Loss (dB) | X (mm) | Y (mm) | Z (mm) | X (mm) | Y (mm) | Z (mm) | DC Pins | Lead Time (if not in stock) |
Package Substrate Info | Request Access Form | Data Sheet | Buy |
| PSP1028104 | 1028940-007 | 95 | 0.65 | 12 | 5.71 | 5.55 | 0.1 | 9 | 9 | 0.7 | 16 | 13 weeks |  |
 |
 |
|
| PSP1028105 | 1028940-006 | 95 | 0.65 | 12 | 4.71 | 4.55 | 0.1 | 8 | 8 | 0.7 | 14 | 13 weeks | |
|
|
|
| PSP1028106 | 1028940-005 | 95 | 0.65 | 12 | 3.71 | 3.55 | 0.1 | 7 | 7 | 0.7 | 12 | 13 weeks | |
|
|
|
| PSP1028107* | 1028940-004 | 95 | 0.65 | 12 | 2.71 | 2.55 | 0.1 | 6 | 6 | 0.7 | 12 | 13 weeks | |
|
|
|
| PSP1028108* | 1028940-003 | 95 | 0.65 | 12 | 1.71 | 1.55 | 0.1 | 5 | 5 | 0.7 | 8 | 13 weeks | |
|
|
|
| PSP1028109* | 1028940-005 | 50 | 0.3 | 12 | 5 | 5 | 0.1 | 7 | 7 | 0.4 | 12 | 9 weeks | |
|
|
|
| PSP1028110 | 1028940-004 | 50 | 0.3 | 12 | 4 | 4 | 0.1 | 6 | 6 | 0.4 | 10 | 9 weeks | |
|
|
|
| PSP1028111* | 1028940-003 | 50 | 0.3 | 12 | 3 | 3 | 0.1 | 5 | 5 | 0.4 | 8 | 9 weeks | |
|
|
|
| PSP1028112* | 1028940-002 | 50 | 0.3 | 12 | 2 | 2 | 0.1 | 4 | 4 | 0.4 | 6 | 9 weeks | |
|
|
|
| PSP1028113 | 1028940-001 | 50 | 0.3 | 12 | 1 | 1 | 0.1 | 3 | 3 | 0.4 | 4 | 9 weeks | |
|
|
|
* Available Now
Device Specific mmWave Packages
| Package Size | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number | Matching Device | Manufacturer | X (mm) | Y (mm) | Z (mm) | Lid # | Lead Time (if not in stock) |
Package Substrate Info | Request Access Form | Data Sheet | Buy |
| PSP1025530_002 | ALP302 | Northrop Grumman | 6.34 | 3.869 | 1.513 | 1025503 | 13 weeks | |
|
 |
|
| PSP1029439 | TGA2962 | Qorvo | 5.5 | 6 | 1.425 | 1028940-009 | 9 weeks | |
|
|
|
Our millimeter wave transmission lines are engineered for ultra-low loss and high isolation, enabling precise signal routing in densely integrated RF systems. The air-dielectric, coaxial, monolithic lines support wideband operation with low insertion loss and excellent phase stability. They feature wirebond-compatible interfaces for seamless transitions to ceramic thin-film or MMIC devices, as well as surface-mount terminations for direct integration with standard PCB architectures, offering maximum flexibility across diverse system designs.
Interconnect Transmission Lines and Crossovers
| Part Number | Description | Launch | Frequency (GHz) | Insertion Loss | Isolation (*Shielded) | Market | Data Sheet | Buy |
|---|---|---|---|---|---|---|---|---|
| PSTLC04W | Dual-Path Crossover | Wire-bond | DC - 70 | 0.2 dB | -80 dB* | Defense, T&M, Satcom | |
|
| PSTLC02S | Single-Path Crossover | SMT | DC - 50 | 0.2 dB | -40 dB | Defense, T&M, Satcom | |
|
| PSTLC02SV2 | Dual-Path Crossover | SMT | DC - 50 | 0.2 dB | -75 dB* | Defense, T&M, Satcom | Coming soon | |
| PSTLC04S | Dual-Path Crossover | SMT | DC - 50 | 0.2 dB | -45 dB | Defense, T&M, Satcom | |
|
Don’t see what you’re looking for?
Get in Touch
Talk to our experts to find the products or integrated solutions for your applications.