In the PolyStrata process, Nuvotronics’ proprietary photoresist material is used on a substrate to form a structural mold for electroplating copper layers — or “strata” — ranging in thickness from 10 to 100 µm. This process is repeated layer-upon-layer to create 3D copper structures, such as a coax line, defined by the photolithography of the resist material as well as the planarization of the individual strata.
The result is a device with micron-level precision in all three axes. Leveraging these tight tolerances, microcoaxial transmission lines, resonators and other unique structures form the basis for the highly repeatable components that are created in the process. Throughout the build process, we have a unique ability to embed dielectric materials that can be used to support and suspend the center conductors of the microcoax. Once the build process is complete, the photoresist mold material is removed using a proprietary release method, leaving a 3D air-dielectric copper structure that is detached from the substrate, passivated and integrated into your system via industry standard processes.
The entire process leverages advanced automated manufacturing equipment from adjacent PCB, solar and semiconductor industries, allowing us to deliver PolyStrata at a scale that matches the rising demand for high-frequency wireless components. Our utilization of automated assembly and test equipment ensures reliable, repeatable performance at volume.
