PolyStrata® Technology

The premier technology for millimeter wave components.

The Nuvotronics PolyStrata technology was built to address the growing demand for higher operating frequencies and wider bandwidths in communications and defense markets. Over the last 20 years, the technology has evolved from a DARPA-funded technology demonstration into a panel-scale manufacturing process sized to meet today’s rapid demands for high-frequency electronic components, driven most recently by the proliferation of global LEO broadband and millimeter wave communications systems. The technology offers a robust solution for the formation of high-performance RF components, tailored to meet the demanding requirements of aerospace and military applications.

3D air-dielectric interconnection and packaging technology.

Nuvotronics’ patented PolyStrata micro-fabrication process is the first manufacturing technology to deliver 3D additive manufacturing copper air-dielectric interconnection and packaging to create mmWave devices with unprecedented levels of RF performance, integration, density, and miniaturization, with a 10x to 100x improvement in size, weight and power (SWaP). The micro-coaxial structures created by the PolyStrata process produce mmWave and microwave devices with ultra-low losses, superior isolation, improved thermal characteristics and ultra-high frequency performance.

The PolyStrata Process

In the PolyStrata process, Nuvotronics’ proprietary photoresist material is used on a substrate to form a structural mold for electroplating copper layers — or “strata” — ranging in thickness from 10 to 100 µm. This process is repeated layer-upon-layer to create 3D copper structures, such as a coax line, defined by the photolithography of the resist material as well as the planarization of the individual strata. 

The result is a device with micron-level precision in all three axes. Leveraging these tight tolerances, microcoaxial transmission lines, resonators and other unique structures form the basis for the highly repeatable components that are created in the process. Throughout the build process, we have a unique ability to embed dielectric materials that can be used to support and suspend the center conductors of the microcoax. Once the build process is complete, the photoresist mold material is removed using a proprietary release method, leaving a 3D air-dielectric copper structure that is detached from the substrate, passivated and integrated into your system via industry standard processes.

The entire process leverages advanced automated manufacturing equipment from adjacent PCB, solar and semiconductor industries, allowing us to deliver PolyStrata at a scale that matches the rising demand for high-frequency wireless components. Our utilization of automated assembly and test equipment ensures reliable, repeatable performance at volume.

Features & Benefits

  • Size & weight reduction: 10x-100x reduction compared to conventional technologies
  • Broadband performance, covering DC to over 100 GHz
  • High thermal conductivity: 400W/mk
  • Low loss, shielded components with exceptional isolation
    Highly repeatable batch manufacturing process
  • Standard surface-mount and wirebond interfaces

Tailored to meet your needs.

Don’t see something that meets your exact requirements in our ever-growing catalog of standard products? Our experienced design center is equipped with all the tools necessary to provide complete solutions to customer specifications. Nuvotronics owns and maintains a set of design rules that governs the PolyStrata process, giving design engineers the ability to create complex 3D miniature circuit components using 3D CAD software and seamlessly transfer those designs to artwork processable by our manufacturing equipment. The incredible repeatability of our process ensures as-designed performance in the final product.

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