Small Solutions to Big Problems
News and Events

DARPA ICECool Program February 05, 2014

Nuvotronics LLC has been awarded a contract from the Defense Advanced Research Projects Agency (DARPA) and Air Force Research Labs (AFRL) in Intrachip/Interchip Enhanced Cooling Applications (ICECool Apps) to be performed through DARPA’s Microsystem Technology Office (MTO). Nuvotronics will use its high definition large scale copper interconnect process to not only provide high performance electrical manifolds for RF GaN MMIC amplifiers but also focus on an integrated thermal management solution that is ultra-compact and efficient. Program goals target heat fluxes in excess of 30 KW/cm2 with package level heat removal density of greater than 2KW/cm3.